Thermal issues in microsystems packagingNAKAYAMA, Wataru.IEEE transactions on advanced packaging. 2000, Vol 23, Num 4, pp 602-607, issn 1521-3323Article

A methodology to work on geometrically complex heat transfer systems: the cases of heat conduction through composite slabsNAKAYAMA, Wataru.International journal of heat and mass transfer. 2003, Vol 46, Num 18, pp 3397-3409, issn 0017-9310, 13 p.Article

Max Jakob Award Paper—Heat in Computers: Applied Heat Transfer in Information TechnologyNAKAYAMA, Wataru.Journal of heat transfer. 2014, Vol 136, Num 1, issn 0022-1481, 013001.1-013001.22Article

The Heat Transfer Society of Japan, the 50th Anniversary: Retrospect and ProspectNAKAYAMA, Wataru.Heat transfer engineering. 2013, Vol 34, Num 4-6, pp 409-419, issn 0145-7632, 11 p.Conference Paper

Two-phase heat spreaders utilizing microfabricated boiling enhancement structuresMURTHY, Sunil; JOSHI, Yogendra; NAKAYAMA, Wataru et al.Heat transfer engineering. 2004, Vol 25, Num 1, pp 26-36, issn 0145-7632, 11 p.Article

Methods for thermal optimization of microchannel heat sinksSUNG JIN KIM.Heat transfer engineering. 2004, Vol 25, Num 1, pp 37-49, issn 0145-7632, 13 p.Article

A CFD Study on the Effect of Shrinking Box Size on Cooling Airflows in Compact Electronic Equipment : The Case of Portable Projection Display EquipmentMAGUIRE, Luke; NAKAYAMA, Wataru; BEHNIA, Masud et al.Heat transfer engineering. 2008, Vol 29, Num 2, pp 188-197, issn 0145-7632, 10 p.Article

Experimental investigation of a heat switch based on the precise regulation of a liquid bridgeJEONG, Su-Heon; NAKAYAMA, Wataru; LEE, Sun-Kyu et al.Applied thermal engineering. 2012, Vol 39, pp 151-156, issn 1359-4311, 6 p.Article

Challenges in Cooling Design of CPU Packages for High-Performance ServersJIE WEI.Heat transfer engineering. 2008, Vol 29, Num 2, pp 178-187, issn 0145-7632, 10 p.Article

Single-phase flow and heat transport and pumping considerations in microchannel heat sinksGARIMELLA, Suresh V; SINGHAL, Vishal.Heat transfer engineering. 2004, Vol 25, Num 1, pp 15-25, issn 0145-7632, 11 p.Article

Electro-Thermal Behavior of a Sub-Micrometer Bulk CMOS Device : Modeling of Heat Generation and Prediction of TemperaturesHATAKEYAMA, Tomoyuki; FUSHINOBU, Kazuyoshi.Heat transfer engineering. 2008, Vol 29, Num 2, pp 120-133, issn 0145-7632, 14 p.Article

A Proper Orthogonal Decomposition Based System-Level Thermal Modeling Methodology for Shipboard Power Electronics CabinetsHAIDER, Syed I; BURTON, Ludovic; JOSHI, Yogendra et al.Heat transfer engineering. 2008, Vol 29, Num 2, pp 198-215, issn 0145-7632, 18 p.Article

Experimental investigation of the thermal performance of piezoelectric fansACIKALIN, Tolga; WAIT, Sydney M; GARIMELLA, Suresh V et al.Heat transfer engineering. 2004, Vol 25, Num 1, pp 4-14, issn 0145-7632, 11 p.Article

New design of a liquid bridge heat switch to ensure repetitive operation during changes in thermal conditionsJEONG, Su-Heon; NAM, Sung-Ki; NAKAYAMA, Wataru et al.Applied thermal engineering. 2013, Vol 59, Num 1-2, pp 283-289, issn 1359-4311, 7 p.Article

Compact Thermal Network Model of the Thermal Interface Material Measurement Apparatus with Multi-Dimensional Heat FlowKIM, Jung-Kyun; NAM, Sung-Ki; NAKAYAMA, Wataru et al.IEEE transactions on components, packaging, and manufacturing technology (2011. Print). 2011, Vol 1, Num 7-8, pp 1186-1194, issn 2156-3950, 9 p.Article

Comparison of Fluid Flow and Thermal Characteristics of Plate-Fin and Pin-Fin Heat Sinks Subject to a Parallel FlowSUNG JIN KIM; KIM, Dong-Kwon; HWAN HEE OH et al.Heat transfer engineering. 2008, Vol 29, Num 2, pp 169-177, issn 0145-7632, 9 p.Article

Dynamics of a liquid plug in a capillary duct powered by vapor explosionSUZUKI, Osamu; JOSHI, Yogendra K; NAKAYAMA, Wataru et al.Microelectronics journal. 2003, Vol 34, Num 3, pp 195-200, issn 0959-8324, 6 p.Conference Paper

Thermo-Mechanical Challenges in Stacked PackagingAGONAFER, Dereje; KAISARE, Abhijit; HOSSAIN, Mohammad M et al.Heat transfer engineering. 2008, Vol 29, Num 2, pp 134-148, issn 0145-7632, 15 p.Article